UMC and Mentor Graphics Introduce Foundry Design Kits (FDK) for Mixed-Mode and RF Technologies

FDKs now available for customer download at MyUMC online

HSINCHU, Taiwan and WILSONVILLE, Ore. - May 13, 2008 - UMC (NYSE: UMC; TSE, 2303), a leading global semiconductor foundry, and Mentor Graphics Corporation (Nasdaq: MENT) today announced they have partnered to offer a new series of analog/mixed-signal and RF foundry design kits (FDKs). The FDKs, containing comprehensive and validated building blocks at the transistor device level, help IC designers to jump-start design cycles on UMC's 0.13um and 90nm MM/RF process nodes. Featuring Mentor's analog/mixed-signal IC flow, the FDK's are poised to reduce time-to-market and optimize manufacturing success for analog, mixed mode and RF system-on-chip (SoC) ICs.

"Mentor's FDKs for UMC's advanced MM/RF process provide our customers with key technology to help them achieve first silicon success," said Lee Chung, vice president of global marketing at UMC. "Since the FDKs are validated within Mentor's complete mixed-signal SoC design flow, customers can gain competitive time-to-manufacturing advantages with the assurances of a proven, turn-key methodology and a proven path to silicon."

The comprehensive FDKs include UMC Eldo simulation models, Calibre DRC, LVS and extraction technology files, schematic symbols and programmable device generators for supporting schematic driven layout and simulation, along with a set of configuration files for customization.

"We are pleased to partner with UMC to offer this comprehensive set of FDKs," noted Jue-Hsien Chern, vice president of DSM at Mentor Graphics. "The combination of UMC's production-proven, mixed-signal and RF processes and Mentor's world-class, optimized mixed-signal design flow will enable our mutual customers to have optimal control and predictability over their SoC design and manufacturing."

UMC's mainstream 0.13um process employs up to 8 layers of copper interconnects to enable a gate density of 220K gates/mm2. UMC's 90nm process has been in customer production since March of 2003, making UMC the first dedicated foundry company to announce the delivery of working customer ICs built on this technology node. UMC and Mentor Graphics will continue to extend FDK offerings to 65nm and beyond by leveraging Mentor's IC flow, which contains a unified design platform with a centralized design cockpit that allows seamless navigation throughout the entire analog mixed-signal IC design flow, from schematic capture, simulation and floor planning, to physical layout and final verification.

About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced system-on-chip (SoC) designs for applications spanning every major sector of the IC industry. UMC's SoC Solution Foundry strategy is based on the strength of the company's advanced technologies, which include production proven 90nm, 65nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.

About Mentor Graphics
Mentor Graphics Corporation (Nasdaq: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world's most successful electronics and semiconductor companies. Established in 1981, the company reported revenues over the last 12 months of over $875 million and employs approximately 4,350 people worldwide. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com/.

Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.