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Cadence Collaborates with UMC to Deliver
65nm CPF-Based Low-Power Reference Design Flow
CPF-Based 65nm Low-Power Reference
Design Flow Address Complex Design Issues and Accelerates High-Performance,
Low-Power Designs
DESIGN AUTOMATION CONFERENCE, Anaheim, Calif. - June 9, 2008
- Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global
electronic-design innovation, and UMC (NYSE: UMC, TSE: 2303), a
leading global semiconductor foundry, today announced the availability
of a Common Power Format (CPF)-based low-power reference design
flow targeted to the UMC 65-nanometer process. This reference flow
enables customers to achieve optimal 65-nanometer low-power designs
when used with UMC's Low Power Kit, which includes CPF-enabled libraries
and other intellectual property.
This 65-nanometer low-power reference design flow uses UMC's "Leon"
test chip as the reference design. Leon is an open source 32-bit
RISC microprocessor core with other complex elements including SRAM.
The Leon chip was partitioned into multiple voltage domains using
the Cadence Low-Power Solution for design, verification, implementation
and analysis. As proven with the Leon test chip, the combination
of the 65-nanometer reference design flow and the UMC Low Power
Kit enables increased productivity while managing design complexity,
shortening time-to-market and reducing manufacturing risk.
The UMC 65-nanometer low-power reference design flow highlights
key capabilities of the Cadence Low-Power Solution, including Cadence
Incisive Unified
Simulator for gate-level low-power simulation; Cadence Encounter
RTL Compiler for synthesis, low-power and DFT cell insertion; Encounter
Conformal Low Power for equivalence checking and low power design
implementation checking; Encounter Test for ATPG; SoC Encounter
RTL-to-GDSII system for floorplanning, powerplan and place-and-route;
Encounter Timing System for timing and SI signoff; Cadence QRC Extraction;
VoltageStorm
Power Encounter for static power and IR analysis; and VoltageStorm
Dynamic Gate and Virtuoso
UltraSim for dynamic analysis of current surge at power up. In addition,
UMC's Low Power Kit, including its CPF-enabled library, was validated
as part of the reference design flow development.
"We are working closely with Cadence to address complex design
issues that face designers at 65 nanometers, while enabling faster
time to volume through an integrated low-power solution," said
Darsun Tsien, UMC's vice president of design methodology. "Through
our ongoing collaboration with Cadence, we are able to provide designers
with validated low-power technologies to manage power concerns and
meet aggressive time-to-market goals:"
"This CPF-based flow, the result of a joint effort between
Cadence and UMC, accelerates implementation of low-power designs,"
said Chi-Ping Hsu, corporate vice president of IC Digital and Power
Forward at Cadence. "The combination of UMC process technology
and the Cadence Low-Power Solution provides our mutual customers
with the ability to realize their aggressive project goals while
preserving low-power intent throughout the design process."
Availability
This reference flow package includes design resources, implementation
scripts, an application note and a comprehensive workbook. This
65-nanometer Low Power reference design flow is slated for availability
in July 2008 through UMC sales.
About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry
that manufactures advanced system-on-chip (SoC) designs for applications
spanning every major sector of the IC industry. UMC's SoC Solution
Foundry strategy is based on the strength of the company's advanced
technologies, which include production proven 90nm, 65nm, mixed
signal/RFCMOS, and a wide range of specialty technologies. Production
is supported through 10 wafer manufacturing facilities that include
two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab
12i are both in volume production for a variety of customer products.
The company employs approximately 13,000 people worldwide and has
offices in Taiwan, Japan, Singapore, Europe, and the United States.
UMC can be found on the web at http://www.umc.com.
About Cadence
Cadence enables global electronic-design innovation and plays an
essential role in the creation of today's integrated circuits and
electronics. Customers use Cadence software and hardware, methodologies,
and services to design and verify advanced semiconductors, consumer
electronics, networking and telecommunications equipment, and computer
systems. Cadence reported 2007 revenues of approximately $1.6 billion,
and has approximately 5,100 employees. The company is headquartered
in San Jose, Calif., with sales offices, design centers, and research
facilities around the world to serve the global electronics industry.
More information about the company, its products, and services is
available at http://www.cadence.com
Cadence, Encounter, Incisive, Conformal,
Virtuoso and VoltageStorm are registered trademarks, and the Cadence
logo and SoC Encounter are trademarks, of Cadence Design Systems,
Inc. All other trademarks are the property of their respective owners.
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UMC
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CADENCE |
KJ Communications
Eileen Elam
(408) 927-7753
eileen@kjcompr.com
In Taiwan:
UMC
Alex Hinnawi
(886) 2-2700-6999 ext. 6958 |
Cadence Design Systems, Inc.
Sophy Shen
(886) 3-566-3834
sophys@cadence.com
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